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Sponsorship Opportunities

Sponsors

Sponsorships for Microtech Innovation Summit 2019 are available. For further information and questions about sponsorships, please click here.


Gold Sponsor

Micralyne is a leading independent MEMS foundry, and volume manufacturer of novel MEMS devices with over 30 years of MEMS development and manufacturing expertise. Micralyne’s fabrication solutions have been used in MEMS sensors for precise measurement devices, MEMS optical switching technology, lab-on-a-chip components, micro-needles, pressure sensors, gas sensors, accelerometers, thermal imaging sensors, and microfluidics. We are both ISO9001 and ISO13485 certified. Micralyne’s MEMS foundry model allows clients to access enhanced services such as validated MEMS technology processes and platforms, advanced packaging – WLP, TSV, TGV, discrete and custom sub-assembly services. This foundry model has successfully produced products for industries such as: bio-medical, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities coupled with an integrated quality and project management support. Connect with us today and leverage our experience to manufacture your MEMS devices.


Gold Sponsor

SilTerra Malaysia is a semiconductor wafer foundry offering a full range of process technologies covering our core business in CMOS technologies (advanced logic, RFCMOS, mixed signal and high voltage) to leading edge technologies in MEMS, silicon photonics, bio-photonics and power. SilTerra’s wafer fab has a capacity of 40,000 eight-inch wafers per month. SilTerra also offers MEMS foundry services and a unique MEMS-on-CMOS technology. Under the MEMS foundry services, we help customers realize working prototypes from their proof of concept, support the transfer or set-up of customer owned process and ramp-up to high volume manufacturing (all in one fab). With our MEMS-on-CMOS technology, we have the capability to build the MEMS devices on pre-processed CMOS wafers thus offering a “truly monolithic MEMS integrated solution”. This integrated technology provides a cost-effective, multi-functional chip with a smaller footprint. SilTerra provides proven silicon validated MEMS devices to our customers. SilTerra offers various MEMS on CMOS devices such as: pMUT(piezoelectric micromachined ultrasonic transducers), BAW and SAW (bulk and surface acoustic wave) resonators, optical micro-mirror arrays, zero level package (ZLP), nano-wires, and sensors. Applications include frequency control products, data projectors, finger print sensors, medical imaging and industrial sensors.


Silver Sponsor

ULVAC Technologies, Inc. (ULVAC) was established in 1992 as the US subsidiary of ULVAC, Inc. Headquartered in Methuen, Massachusetts, ULVAC provides a broad portfolio of manufacturing equipment for the vacuum, materials and thin film industries. ULVAC's solutions diversely incorporate equipment, materials, analysis, and services for flat panel displays, electronic components, semiconductors, MEMS and general-industry equipment. In addition, the Methuen facility is equipped with a class-10 cleanroom for process development, customer demonstration and manufacturing of the ENVIRO solvent-free dry photo resist stripper and compound semiconductor materials etch systems. Other in-house services include foundry etch (for deep oxide and compound semiconductor materials), thermal processing, materials characterization, and vacuum pump/leak detector repair. ULVAC supports a variety of MEMS production technologies, for applications ranging from micro sensors to flow channel modules, optical switches, and bio-MEMS.


Program Sponsor

SÜSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. In close cooperation with research institutes and industry partners SÜSS MicroTec contributes to the advancement of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SÜSS MicroTec supports more than 8,000 installed systems worldwide.


Innovation Sponsor

When you need custom MEMS & Micro Devices for your system, you can rely on our experts to really understand your requirements. Our 140 experts working at the MEMS Foundry and Micro Devices Facility follow a phase-gated approach to demonstrate feasibility and give proof of concept, develop the process to the required maturity level and manufacture your devices with the right quality.


Simulation Sponsor

OnScale is the world’s first Solver-as-a-Service platform – a combination of advanced computer-aided engineering (CAE) multi-physics solvers with a scalable cloud high-performance computing (HPC) engine. OnScale breaks performance barriers for engineers by providing near-limitless Cloud HPC resources to solve today’s toughest engineering challenges. OnScale also breaks cost barriers for engineering teams of all sizes by providing world-class CAE multi-physics solvers and Cloud HPC on a subscription-based pay-as-you-go pricing model. With OnScale, engineers can run massive multi-million degree-of-freedom multi-physics simulations and vast numbers of simulations in parallel to optimize systems like ultrasonic transducer arrays for near-field 3D object classification for ADAS applications very quickly with minimal cost. Design studies that were once impossible with legacy CAE tools and on-premise HPC are now possible.


Breakfast Sponsor

When you need custom MEMS & Micro Devices for your system, you can rely on our experts to really understand your requirements. Our 140 experts working at the MEMS Foundry and Micro Devices Facility follow a phase-gated approach to demonstrate feasibility and give proof of concept, develop the process to the required maturity level and manufacture your devices with the right quality.


Research and Development Partner


The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden, Germany is your access to know-how, expertise and modern R&D infrastructure in the field of optical sensors and actuators, integrated circuits, microsystems (MEMS/MOEMS) and nanoelectronics. The Fraunhofer IPMS is one of 72 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Germany, and also in Europe. It is devoted to research of practical utility. Relying on 25,000 employees, the Fraunhofer-Gesellschaft has a research budget of 2.6 billion euros.


Media Sponsor


Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Our focus is on the unique requirements of each of these devices in terms of the design tools, process equipment and materials, and test equipment. We are specifically focused on the processes and materials used in semiconductor manufacturing, including lithography, deposition, etch, planarization, implant, annealing/diffusion and cleaning, as well as the inspection tools needed to measure film thickness, critical dimensions, check for defects, etc. Our coverage is global, looking at manufacturing activity in the U.S., China, Taiwan, Korea, Japan, Europe and Southeast Asia (Philippines, Singapore, Malaysia), as well as Brazil, Russia and India. Semiconductor Digest consists of a website, a magazine, a daily newsletter and six topical newsletters.


Sponsorship Opportunities

For further information or questions about sponsorships, please contact Jessica Ingram at
jessica@memsjournal.com or call 360-929-0114.

Platinum Sponsor ($15,000) – 1 available – includes:

  • Six (6) conference and reception admissions (transferable to individuals outside of sponsor’s company or organization)
  • Printed conference program and presentation slides in electronic format
  • Preliminary attendee list with contact information (one week in advance of event) and final attendee list with contact information (one weeks after event)
  • Full exhibit package (details listed here)
  • 10-minute company introduction speaking slot during main conference session
  • Full-page ad in printed conference program
  • Recognition as Platinum Sponsor, company logo and description in printed conference program and on printed conference signage
  • Recognition as Platinum Sponsor, company logo and description on event website and in pre-event marketing materials; company name listed on all pre-event press releases and media alerts
  • Company will receive marketing exposure through promotional campaign by MEMS Journal and other media partners of the event. Event promotions will reach 70,000 to 80,000 individuals in the MEMS, sensors, microtechnology, electronics, and semiconductor industry segments.

Gold Sponsor ($12,500) – booked – includes:

  • Five (5) conference admissions
  • Full-page ad in printed conference program
  • Recognition as Gold Sponsor
  • All other items the same as Platinum Sponsor

Silver Sponsor ($10,000) – booked – includes:

  • Four (4) conference admissions
  • Full-page ad in printed conference program
  • Recognition as Silver Sponsor
  • All other items the same as Platinum Sponsor

Lanyard Sponsor ($10,000) – 1 available – includes:

  • Four (4) conference admissions
  • Company’s logo placed on the attendee lanyards
  • Full-page ad in printed conference program
  • Recognition as Lanyard Sponsor
  • All other items the same as Platinum Sponsor

Program Sponsor ($9,000) – booked – includes:

  • Four (4) conference admissions
  • Company's logo on the cover of the printed conference program
  • Full-page ad in printed conference program
  • Recognition as Program Sponsor
  • All other items the same as Platinum Sponsor

Innovation Sponsor ($8,500) – booked – includes:

  • Three (3) conference admissions
  • Full-page ad in printed conference program
  • Recognition as Innovation Sponsor
  • All other items the same as Platinum Sponsor

Simulation Sponsor ($8,000) – booked – includes:

  • Three (3) conference admissions
  • Full-page ad in printed program
  • Recognition as Simulation Sponsor
  • All other items the same as Platinum Sponsor

Reception Sponsor ($7,500) – 2 available – includes:

  • Three (3) conference admissions
  • Half-page ad in printed program
  • Recognition as the Reception Sponsor
  • All other items the same as Platinum Sponsor

Lunch Sponsor ($7,000) – 2 available – includes:

  • Three (3) conference admissions
  • Half-page ad in printed conference program
  • Recognition as the Lunch Sponsor
  • All other items the same as Platinum Sponsor

Breakfast Sponsor ($6,000) – booked, 1 available – includes:

  • Three (3) conference admissions
  • Half-page ad in printed conference program
  • Recognition as the Breakfast Sponsor
  • All other items the same as Platinum Sponsor

Internet Sponsor ($5,500) – 1 available – includes:

  • Three (3) conference admissions
  • Half-page ad in printed conference program
  • Recognition as the Internet Sponsor
  • All other items the same as Platinum Sponsor