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Technology Innovation Showcase Presenters
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Speakers and Presentation Topics

People Tracking, Vital Signs Monitoring, and Gesture Recognition Using Radar
Veronique Baudon
Strategic Partnership Manager
imec

Wherever there are humans, there is movement. RF sensing technology detects human activity via movements as tiny as the micro-skin effects related to a heartbeat. Core applications include indoor people tracking, health and driver monitoring, and human-machine interaction through a gesture interface. There are several advantages to using radar technology in these applications. For indoor people tracking, radar sensors are better suited than cameras for privacy and spaces with low or no light. Radars are also a game changer as they can measure vital signs without contact or use of a wearable device. Complementary to voice control technology, gesture technologies based on radar near THz has a smaller footprint and can have a better field of view. On the other hand, a radar needs to overcome its limited angular resolution through advanced machine learning techniques. In this talk, we will present core applications use cases and a first-of-a-kind radar chip operating in the 145GHz band. It uses 10 GHz bandwidth, which results in an ultra-fine range resolution of 1.5cm, in combination with an unprecedented doppler resolution. We will also provide an overview of other companies and research groups working radar technologies for these types of applications.

Biography: Veronique Baudon has an Engineering Master’s degree in Computer Sciences and Mathematics in National Polytechnic Institute of Grenoble. She also has an MBA from ESA business school in Grenoble. Veronique has a broad experience in the semiconductor and technology industries. She has over 20 years of expertise working with partners, cross functionally, and in multi-cultural global team environment. She has been managing partnerships from startups to Fortune 100 companies. Veronique worked for numerous years in CTO, product marketing, strategic business development, and partnerships positions. She is a strategic thinker and business leader, and is passionate about innovation and technology for good causes. She has proven success in partnership management and with analysing competition, market dynamics, and customer insights to envision trends and build solutions.


Resonant MEMS and NEMS Devices for Quantum Engineering
Philip Feng, PhD
Professor
University of Florida, Department of Electrical & Computer Engineering

A century ago, the quantum revolution began to profoundly change the world and our lives. Today we already rely on the marvelous consequences of the quantum science, which is so ubiquitous that we often take it for granted. An essential theme of the ongoing “second quantum revolution” is to realize human-made structures and devices, where “quantum phenomena” can be sustained and harnessed to enable radically new approaches to information processing. These require exquisite creation and scalable fabrication of atom-like devices, design and engineering of new information carriers, and new transduction schemes. Only recently have quantum phenomena been incorporated into technologies toward next-generation computers, sensors, and detectors that demonstrate performance characteristics rivaling those of their conventional counterparts, thus promising enormous potential for future quantum technologies. This short tutorial-style courseaims to capture the state-of-the-art knowledge of quantum materials, devices, and technology platforms. It will particularly focus on resonant MEMS and NEMS devices in quantum regime, the enablingmicro/nanofabrication techniques, manufacturing and integration processes, device fundamentals, engineering principles, and their roles and applications in quantum signal transduction, sensors, metrology, and the development of hybrid quantum systems and networks.

Biography: Dr. Philip Feng is a Professor in Electrical and Computer Engineering at the University of Florida. His research is focused on emerging solid-state devices and integrated micro/nanosystems, especially those in advanced semiconductors, 2D materials and heterostructures, and their heterogeneous integration with mainstream technologies. He received his PhD in EE from California Institute of Technology. Philip was an invited participantat the National Academy of Engineering (NAE) 2013 U.S. Frontier of Engineering (USFOE) Symposiumand, subsequently, a recipient of the NAE Grainger Foundation Frontiers of Engineering (FOE) Award in 2014. His recent awards includethe NSF CAREER Award, the Presidential Early Career Award for Scientists and Engineers (PECASE), and several Best Paper Awards (with his students). Philipis an associate editor forIEEEUltrasonics, Ferroelectricsand Frequency Control (UFFC), and served on Technical Program Committees (TPC) and as Track/Session Chairs for IEEE IEDM, IEEE MEMS, Transducers, IEEE IFCS, IEEE SENSORS, IEEE NANO, and as the MEMS/NEMS Chair for AVS’ 61st to 63rd International Symposia.


Paper and Plastic Sensors: Emerging Technologies and Applications
Alissa Fitzgerald, PhD
Founder and CEO
A.M. Fitzgerald & Associates

In the electronics industry, market forces have always motivated a migration from higher cost to lower cost substrate materials. LEDs went from sapphire to silicon, interposers from silicon to glass, and microfluidics from glass to plastic. Many anticipated applications for the Internet of Things, particularly smart packaging and single-use items, can only be realized with very low-cost sensors at less than a penny per unit. The relatively high price of silicon, however, prevents silicon MEMS sensors from meeting that price target, even at tiny chip sizes. Only sensors made from a less expensive substrate, such as paper or plastic, would be economical for high volume, disposable applications. Fortunately, creative researchers have been working for years on designing and developing very low-cost sensors, such as biodegradable polymer pressure sensors and paper-based food freshness gas sensors, using methods which do not require a cleanroom fab. This talk will highlight several emerging low-cost sensor technologies, and discuss how and when they might enter the marketplace.

Biography: Dr. Alissa Fitzgerald founded A.M. Fitzgerald & Associates, LLC, a MEMS and sensors solutions company, in 2003. She has over 20 years of engineering experience in MEMS design, fabrication, and product development, and has personally developed more than a dozen MEMS devices. She now advises clients on the entire MEMS product development cycle, from business and IP strategy, to engineering, operations, foundry transfer, and supply chain management. Prior to founding A.M. Fitzgerald, Dr. Fitzgerald worked at the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation, now part of Siemens. She received her Bachelor's and Master's degrees from MIT and her doctorate from Stanford University, in Aeronautics and Astronautics. Dr. Fitzgerald has numerous journal publications and holds seven patents. She served on the Governing Council of the MEMS Industry Group (MIG) from 2008-2014 and was inducted into the MIG Hall of Fame in 2013.


Ultrasound Fingerprint Sensors: Technology Developments and Comparisons
Joy (Xiaoyue) Jiang, PhD
Researcher
UC Berkeley

A variety of physical mechanisms have been exploited to capture electronic images of a human fingerprint, including optical, capacitive, pressure, and acoustic. Compared to other technologies, ultrasonic fingerprint sensors have two major advantages: (1) they are insensitive to contamination and moisture on the finger, and (2) they have the ability to measure images at multiple depths, hundreds of microns from the sensor surface. With the maturity of thin film piezoelectric materials technology and MEMS-CMOS eutectic wafer-bonding processes, piezoelectric micromachined ultrasonic transducer (PMUT) arrays with electrical addressing to individual pixels have been proposed and developed for ultrasonic fingerprint sensors. This presentation will cover the design and testing of a 110 x 56 rectangular PMUT array with a customized CMOS design to demonstrate fingerprint features reconstructed at different imaging depths. We will also provide an overview of the established PMUT fabrication processes. The presentation will include a summary of the current ultrasonic fingerprint sensor research and commercial products on the market.

Biography: Dr. Joy (Xiaoyue) Jiang received her BS degree in mechanical engineering from the University of Rochester, Rochester, New York in 2013, her MS degree in electrical engineering, and PhD degree in mechanical engineering from the University of California at Berkeley in 2015 and 2018 respectively. Her research interests include piezoMEMS, ultrasonic fingerprint sensors, ultrasonic imaging, and MEMS sensors. Currently, Dr. Jiang is doing ultrasonic research and development with TDK InvenSense.


Emerging and Future Applications Enabled by Sensors Technologies
Andrew Maywah
Investment Director
TDK Ventures

As an investor in innovative early-stage startups, we are actively engaged in exploring the diversity of emerging applications leveraging the almost endless variety of sensing technologies.Sensors are bridging the gap between the human experience and the digital world, bringing a wide array of new capabilities and experiences. The advancements abound. Sensors are now driving emerging and future applications in the realms of augmented reality, virtual reality, robotics, health and wellness, autonomous vehicles, as well as other domains. Sensors are often at the very core of interfacing between people, our physical world, and the digital information that we constantly rely on. What are some of the future applications that we see on the horizon? This presentation will explore some of the exciting possibilities and showcase how sensors will drive a whole new set of vibrant, natural, and inspiring experiences. The talk will also include an overview of some of interesting recently funded MEMS and sensors startups.

Biography: Andrew Maywah is an Investment Director at TDK Ventures, and is based in Silicon Valley where he makes venture capital investments in innovative early-stage technology companies. Previously, he was with Silver Tiger Capital, a boutique private equity firm based in Beijing, China, where he oversaw the firm’s cross-border investments. He has several years’experience investing across a variety of sectors including TMT, healthcare, and education. Prior to joining Silver Tiger Capital, Andrew was an investment manager at GO Scale Capital, which is a $500 million cross-border late-stage private equity fund that invests in global companies with proven technology and high-growth potential that can scale in China. Additionally, he has multiple years’ experience in the U.S. and China as a technology startup co-founder. Andrew holds a Bachelor’s degree and Master’s degree in computer science and computer engineering from MIT, and an MBA in finance and entrepreneurial management from The Wharton School at the University of Pennsylvania.


Artificial Intelligence and Image Sensors
Harshita Sahu
Technical Lead
Sony Electronics

Advancements in artificial intelligence are profoundly affecting consumer applications, industrial landscape, and social environment. Growth in AI will lead to better ways to analyze and process data, as well as derive information that is beyond human perceived sensing. This AI-powered sensing will enhance consumer products’ capabilities to superior predictions and decisions and will open up new possibilities in future. In the world of IoT and smart devices, sensors are undergoing great expansion and development, and the combination of both AI and sensor networks are now realities that are going to change our lives. Optical or image sensors, which are one of the most widely used sensors in smartphones and IoT applications,are showing a great amount of innovation with one groundbreaking field being the combination of image sensors with artificial intelligence. Computing, decision making, and “smartness” on the image sensor side is not only an inevitable trend but will also provide intelligent upgrades to the traditional sensing market. This new trendwill also give hardware directionto improve, to provide much higher processing speeds, and system efficiencies when backed up by AI. This talk will provide an overview of the recent technology trends in this field, including existing challenges and upcoming development milestones. The talk will also highlight some of the most interesting startups in this technology area.

Biography: Ms. Harshita Sahuis a Technical Lead for image sensor chip design and verification at Sony Electronics. After finishing herMaster’s degree in technology from IIT Delhi, India in VLSI, Harshita was recruited by Sony Japan through campus placement. Shehad an opportunity to work with Sony Corporation’s headquartersin Japan, and demonstrated Sony’s cutting edge technology in poster presentations and trade exhibitions. Before moving to the United States, Harshita worked in Belgium for almost a year ata depth-sensing based startup (which was acquired by Sony) to create semiconductor designs for depth-sensing image sensors.


Energy Harvesting and Industrial IoT: Emerging Technologies and Applications
Brian Zahnstecher
Principal
PowerRox

The ability to scavenge energy from the ambient environment and use to power devices is not only a great way to mitigate battery usage (particularly in wireless devices), but is also a critical enabler for the billions or even trillions of connected “things” projected to be in operation in our very near future. In fact, EH is one of the most underappreciated enabling technologies for the Internet of Things (IoT) and the deployment of the next-generation networks, typically known as 5G. Industrial IoT (IIoT) applications are projected to be one of the main demand drivers for the majority of all of those (eventually) trillions of devices. In this brief workshop, we will discuss what EH is and the current status of EH technologies. We will also explore the full supporting EH ecosystem, including the necessary components from various parts of the supply chain and the production resources currently available to quickly progress from feasibility to product development and deployment. We will also provide analysis about how EH can extend the life, and eventually eliminate non-rechargeable batteries, which has major technical and financial implications on product sustainability. Finally, we will provide an overview of EH successes and case studies in IIoT deployments and explore how they can be further applied to many new applications such as Smart Cities to Industry 4.0 enablement.

Biography: Brian Zahnstecher is a Senior Member of the IEEE, Chair (Emeritus) of the IEEE SFBAC Power Electronics Society (PELS), sits on the Power Sources Manufacturers Association (PSMA) Board of Directors, is Co-founder and Co-chair of the PSMA Reliability Committee, Co-chair of the PSMA Energy Harvesting Committee, and is the Principal of PowerRox, where he focuses on power design, integration, system applications, OEM market penetration, market research/analysis, and private seminars for power electronics. He co-chairs the IEEE Future Directions (formerly 5G) Initiative webinar series and leads Power for the 5G Roadmap, authored the Group’s position paper, and has lectured on this topic at major industry conferences. He previously held positions in power electronics with industry leaders Emerson Network Power (now Artesyn), Cisco, and Hewlett-Packard, where he advised on best practices, oversaw product development, managed international teams, and designed and optimized voltage regulators. He has been a regular contributor to the industry as an invited keynote speaker, author, roundtable moderator, and volunteer. He has over 15 years of industry experience and holds Master of Engineering and Bachelor of Science degrees from Worcester Polytechnic Institute.


Technology Innovation Showcase Presenters

Allan Biegaj
Sales Representative
AARD Technology

Photonics and MEMS Based Bio-Sensors: Emerging Applications in Digital Olfaction
Tristan Rousselle
Founder and Deputy CEO
Aryballe Technologies

Metrology and Characterization: Emerging Techniques for MEMS and Sensors Devices
Craig Hunter
CEO
Covalent Metrology

Micromachining of Glass: An Overview and Comparison of Fabrication Techniques
Lucas Hof, PhD
Professor
École de Technologie Supérieure, Université du Québec

Jaeyoong Cho
CEO and President
Enertia Microsystems

Robb Smith
CFO
Eshylon Scientific

Towards Soft-Rigid Miniaturized Parallel Robots for Dexterous Micro/Nano-Manipulation
Redwan Dahmouche, PhD
Associate Professor
FRANCHE-COMTE University/FEMTO-ST Institute

Ramesh Ramchandani
CEO
GraphAudio

Integration of Micro-Power Supplies using 3D Interposer Technologies
Hoà Thanh Lê
Postdoctoral Researcher
Harvard University

Emerging Self-Aligned Fabrication Processes for MEMS Manufacturing
Rudy Wojtecki
Research Staff Member
IBM

Design and Applications of an Ultra-Low-Cost MEMS Fabrication Platform
Mitchell Hsing, PhD
Founder
InchFab

Real-Time Nano-Scale Sensing Solutions
Jeffrey Diament
Head of Business Development
InstruMEMS

Rich Oliveri
Director, Sales America
Materion

Flexible Hybrid Electronics: Fabrication Technologies Overview and Emerging Application Trends
Steve Leith, PhD
Director of Engineering and Technology
Microconnex

Willy-An Silvius
Marketing Communications Specialist
Micronit Microtechnologies

Shrinking MEMS Sensors into the Nano-Realm Using Standard CMOS Processes
Josep Montanya i Silvestre, PhD
CEO
Nanusens

Litho and Metrology Solutions for Multi-Layered MEMS Manufacturing
Jumpei Fukui
Deputy Section Manager
Nikon Engineering

Haptic Micro-Actuators Based on Electroactive Polymers: Recent Advances and Emerging Applications
Francois Jeanneu
CEO
Novasentis

MEMS-Based Gas Sensors: Current and Emerging Technologies
Hossain Fahad, PhD
CEO
Serinus Labs

Arjen Janssens
CEO
Solmates

Eduard Sterzer, PhD
Strategy and Sales
Tau Industrial Robotics

Biomedical and Industrial MEMS Sensor Platforms
Jeffrey Krotosky
CTO
Tronics MEMS, TDK Group

MEMS Sockets: A Solution for 3D Multi-Chip Assembly
Hani Gomez
Graduate Researcher
UC Berkeley

Cell-Sized Robots: Emerging Technologies and Potential Applications
Marc Miskin, PhD
Assistant Professor
University of Pennsylvania

Glass and Quartz Wafers for MEMS and Semiconductor Applications
Jonas Discher
Sales
Wafer Universe


Call for Speakers

If you’d like to participate as a speaker, please call Jessica Ingram at 360-929-0114 or send a brief email with your proposed presentation topic to jessica@memsjournal.com. All speakers will receive a complimentary pass to the conference.

  • Business trends, market projections, M&A developments, and startup activity
  • Emerging trends with MEMS, sensors, and microtechnology
  • MEMS manufacturing and fabrication techniques
  • Next generation sensors and MEMS devices
  • Materials, fabrication, packaging, and testing technologies
  • Smart sensing materials
  • Sensor system integration
  • Artificial intelligence for sensors applications
  • Impacts of enabling technologies on new emerging applications
  • Technology transfer, ecosystems and hubs, company formation
  • Supply chain trends and challenges, government regulations, and mandates
  • Flexible-hybrid sensors and electronics
  • Medical MEMS and microsystems
  • Microfluidics and labs-on-chips
  • Nanoscale devices and NEMS
  • Power and energy micro devices
  • Process design, modeling, and modeling technologies
  • Harsh-environment sensors and MEMS devices
  • Chemical and environmental sensors and microsystems
  • MEMS microphones and acoustic microdevices
  • RF MEMS for next generation applications such as 5G telecom networks
  • Advanced packaging technologies
  • Reliability testing and environmental effects compensation methods
  • Integrated photonics and optical MEMS
  • Interface and calibration circuits for sensors